{"product_id":"introduction-to-microsystem-packaging-technology-taylor-francis-inc-9781439819104-yufeng-jin","title":"Introduction to Microsystem Packaging Technology","description":"\u003cp\u003eIllustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.\u003c\/p\u003e","brand":"Yufeng Jin","offers":[{"title":"Default Title","offer_id":52238211580246,"sku":"9781439819104","price":224.31,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781439819104.jpg?v=1767760081","url":"https:\/\/www.bookshop.lt\/products\/introduction-to-microsystem-packaging-technology-taylor-francis-inc-9781439819104-yufeng-jin","provider":"Bookshop","version":"1.0","type":"link"}