Book cover of: 3D Interconnect Architectures for Heterogeneous Technologies. By: Lennart Bamberg
Book cover of: 3D Interconnect Architectures for Heterogeneous Technologies. By: Lennart Bamberg
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3D Interconnect Architectures for Heterogeneous Technologies

Modeling and Optimization

€112,24 €133,57
Autorius Lennart Bamberg
Pristatymas gali užtrukti 2-3 sav.

NEMOKAMAS pristatymas

395 psl.

2022 m.

Kietas viršelis

Brūkšninis kodas: 9783030982287
Aprašymas

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
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